Room temperature, full-wafer 2D/3D stress mapping systems. FSM's patented non-contact Opti-Lever dual-laser auto-switching technology featuring a micropositioning detector to measure the laser beam deflection with high precision over a large dynamic range of small to large bow or stress. Ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.
1. optional fully automated cassette to cassette, SECS/GEM compliant 200/300mm Film Stress and Bow Measurement tool
2. optional semi-automated system with convenient wafer loading and retrieval.
Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
|TEL: 021-5383 8811
FAX: 021-3367 8466