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FSM 128 series

Room temperature, full-wafer 2D/3D stress mapping;

Patented non-contact Opti-Lever dual-laser auto-switching technology;

Ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.

Product description

Room temperature,  full-wafer 2D/3D stress mapping systems. FSM's patented non-contact Opti-Lever dual-laser auto-switching technology featuring a micropositioning detector to measure the laser beam deflection with high precision over a large dynamic range of small to large bow or stress. Ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.

Special Features

1. optional fully automated cassette to cassette, SECS/GEM compliant 200/300mm Film Stress and Bow Measurement tool

2. optional semi-automated system with convenient wafer loading and retrieval.

  • Semiconductor, Solar & Electronics

Technical Specification

1. Proven platform in semiconductor for stress mapping.

2. Stable, accurate and fast.

3. Room temperature.

Contact Us

Shanghai
Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
TEL: 021-5383 8811

FAX: 021-3367 8466
Frontier Semiconductor, IncFrontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels. FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.
[2D, 3D, FSM, 128, Opti-Lever]