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FSM - 413 series

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement;

Non-contact Echoprobe or VITE Technology;

Thin film and surface roughness options.

Product description

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.

Special Features

Semi-automatic system with enclosure. Manual loading, automatic measurement. Warp, Roughness, and Thin Film Thickness measurement options. Systems up to 300mm diameter wafers with or without frame

  • Semiconductor, Solar & Electronics

Technical Specification

1. Proven platform in semiconductor for thickness warpage and TTV measurement.

2. Stable, accurate and fast.

Contact Us

Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
TEL: 021-5383 8811

FAX: 021-3367 8466
Frontier Semiconductor, IncFrontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels. FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.
[FSM, 413 series, 413, TTV, VITE]