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FSM - 413 series

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement;

Non-contact Echoprobe or VITE Technology;

Thin film and surface roughness options.

Product description

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.

Special Features

Semi-automatic system with enclosure. Manual loading, automatic measurement. Warp, Roughness, and Thin Film Thickness measurement options. Systems up to 300mm diameter wafers with or without frame

  • Semiconductor, Solar & Electronics

Technical Specification

1. Proven platform in semiconductor for thickness warpage and TTV measurement.

2. Stable, accurate and fast.

Contact Us

Shanghai
Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
TEL: 021-5383 8811

FAX: 021-3367 8466
Frontier Semiconductor (FSM)FSM is a leading semiconductor metrology equipment manufacturer specialized in optical instrumentation for automated stress and thickness measurement systems, as well as adhesion tester and electrical tests. We are located in San Jose, CA with offices in all major semiconductor locations around the world. Our customers include all major front end and back end semiconductor fabs. We also serve solar, LED, and other semiconductor related industries, as well as universities and research centers.
[FSM, 413 series, 413, TTV, VITE]