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Substrate and tape total and individual thicknesses, warpage, and TTV Measurement;
Non-contact Echoprobe or VITE Technology;
Thin film and surface roughness options.
Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
Semi-automatic system with enclosure. Manual loading, automatic measurement. Warp, Roughness, and Thin Film Thickness measurement options. Systems up to 300mm diameter wafers with or without frame
1. Proven platform in semiconductor for thickness warpage and TTV measurement.
2. Stable, accurate and fast.
| Shanghai Room Unit 605-607, Build 2, Xinglian Building, No.1535 Hongmei Road, Xuhui District, Shanghai |
TEL: 021-5383 8811 FAX: 021-3367 8466 |
FSM is a leading semiconductor metrology equipment manufacturer specialized in optical instrumentation for automated stress and thickness measurement systems, as well as adhesion tester and electrical tests. We are located in San Jose, CA with offices in all major semiconductor locations around the world. Our customers include all major front end and back end semiconductor fabs. We also serve solar, LED, and other semiconductor related industries, as well as universities and research centers.