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FSM 900 series

Upgrade version for 128 series;

Up to 900C;

Non-Contact Laser Scanning Technology;

Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options;

NEW: Optional wafer rotation offers unique 2D/3D mapping.

Product description

Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.

Special Features

Fully automated cassette to cassette system for 300mm wafers. SECS/GEM option.

  • Semiconductor, Solar & Electronics

Technical Specification

1. Proven platform in semiconductor for stress mapping.

2. Stable, accurate and fast.

3. Up to 900C

Contact Us

Shanghai
Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
TEL: 021-5383 8811

FAX: 021-3367 8466
Frontier Semiconductor, IncFrontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels. FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.
[FSM, 900, 900C, 2D, 3D, Thermal Desorption, Film Shrinkage, Reflectivity]