Optical wafer inspection and defect review tool for high resolution front and back side inspection with wafer flip and optional edge inspection.
Macro station module available.
Ideally suited for Litho and OQA.
Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
|TEL: 021-5383 8811
FAX: 021-3367 8466
HSEB Dresden is a leading supplier in optical inspection, review and metrology. We design and manufacture tools, modules and OEM components for wafer sizes up to 450 mm and for any kind of large and flat substrates. Based on a range of well-established inspection systems, we take pride in customizing our tools, until they perfectly fit your needs.
Decades of experience in optics, engineering and software allow us to tailor manual and automated systems which meet all your demands for the manufacture of semiconductor devices and micro-electromechanical systems (MEMS).
Since 1991 and from the background of the founder with the Dresden-based R&D centre of Carl Zeiss Jena, HSEB has evolved from a pure development office into a comprehensive medium-sized production company with a emphasis on development and customization.