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High resolution automatic optical inspection tool (AOI) with 1 µm sensitivity @ 80 wph (300 mm).

Product description

High-end fully automated optical inspection (AOI) system for front and back side
Best-in-class sensitivity and throughput allow for lowest COO in industry
Integrated optical review and metrology functions

Special Features

1. Simultaneous front and back side scan, optional edge inspection‎

2. For 100% excursion control

  • Semiconductor, Solar & Electronics

Technical Specification

1. modular concept to enable 360° view to your wafer including FS/BS and Edge module

2. versatile handling capabilities

3. Ultra Low COO

Contact Us

Room Unit 605-607, Build 2, Xinglian Building,
No.1535 Hongmei Road, Xuhui District, Shanghai
TEL: 021-5383 8811

FAX: 021-3367 8466

HSEB Dresden is a leading supplier in optical inspection, review and metrology. We design and manufacture tools, modules and OEM components for wafer sizes up to 450 mm and for any kind of large and flat substrates. Based on a range of well-established inspection systems, we take pride in customizing our tools, until they perfectly fit your needs.

Decades of experience in optics, engineering and software allow us to tailor manual and automated systems which meet all your demands for the manufacture of semiconductor devices and micro-electromechanical systems (MEMS).

Since 1991 and from the background of the founder with the Dresden-based R&D centre of Carl Zeiss Jena, HSEB has evolved from a pure development office into a comprehensive medium-sized production company with a emphasis on development and customization.

[High end Zeiss optics, Versatile for full wafer inspection, Field benchmark, high end fully-auto, 1um high throughput, inspection, HSEB, ODIN]