文件篮

已储存的网页

已储存的文件

请注意: 此信息已储存入缓存文件内。若您所使用的浏览器会于浏览后删除缓存文件,则有关信息将会消失

帮助

请留下您的信息

×
感谢您的留言

FSM - 413 series

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement;

Non-contact Echoprobe or VITE Technology;

Thin film and surface roughness options.

Product description

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.

Special Features

Semi-automatic system with enclosure. Manual loading, automatic measurement. Warp, Roughness, and Thin Film Thickness measurement options. Systems up to 300mm diameter wafers with or without frame

  • 半导体,太阳能和电子

Technical Specification

1. Proven platform in semiconductor for thickness warpage and TTV measurement.

2. Stable, accurate and fast.

Contact Us

上海
上海市徐汇区虹梅路1535号
星联大厦2幢605-607
TEL: 021-5383 8811

FAX: 021-3367 8466
Frontier Semiconductor (FSM)FSM is a leading semiconductor metrology equipment manufacturer specialized in optical instrumentation for automated stress and thickness measurement systems, as well as adhesion tester and electrical tests. We are located in San Jose, CA with offices in all major semiconductor locations around the world. Our customers include all major front end and back end semiconductor fabs. We also serve solar, LED, and other semiconductor related industries, as well as universities and research centers.
[FSM, 413 series, 413, TTV, VITE]