The spacers are the interleaves placed in between the wafers for protecting the sides from scratches and particle contamination. They are made with very high pure materials offering extreme performances against the particle contamination and the outgassing risks. All the models have embossed shape and are compatible with 4“, 5“, 6“, 8“ and 12“ wafers and framed-wafers.
PEA models: antistatic grade: 350µm thick, Surface resistivity <1*10E+12 Ω
CPS models: conductive grade: 250µm thick, Surface resistivity <1*10E+9 Ω
The rings are also interleaves, but rigid ones, permitting to limit the surface contact in between the wafer. The system guarantee the wafer protection and doesn’t decrease the wafer carrier capacity. They are particularly advised for Bump wafers and CMOS wafers.
PEA models: antistatic
|Part Name||Protos Spacer PEA Type|
|Feature||This is new type antistatic spacer with low particle counts|
|and low ion contamination.||and low ion contamination.|
|Resistance||< 1.0 x 1012Ω|
|Standard||Sheet thickness: 100um, with height of emboss 350um|
CPS models: conductive
|Part Name||Protos Spacer CPS Type|
|Feature||This is new type conductive spacer with low particle counts and low ion contamination.|
|Resistance||< 1.0 x 109Ω|
|Standard||Sheet thickness: 100um, with height of emboss 250mm|