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The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.v

The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

Available models
scia Coat 200
Technical Data
Substrate diameter
Up to 200 mm diameter; Carrier handling for multiple substrate sizes available
Substrate holder
Water cooled, Helium backside cooling contact; Substrate rotation 5 to 20 rpm; Tiltable in‑situ from 0° to 170° in 0.1° steps
Ion beam sources
Sputter source: RF120‑e
Assist source: RF120‑e or RF350‑e
Neutralizer
Plasma bridge neutralizer:
Filament driven N‑DC or RF driven N‑RF
Target holder
Target drum with 4 targets (tiltable),
each with max. 300 mm dia.
Typical deposition rates
Al: 10 nm/min; Al2O3: 15 nm/min
Uniformity variation
≤ 1.5 %
Base pressure
≤ 5 x 10-7 mbar
System dimensions (W x D x H)
2.70 m x 1.70 m x 2.40 m
(without electrical rack and pumps)

The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

The scia Coat 200 applies a beam from a focused broad beam ion source onto a sputter target. The beam of the assist ion source is directed to the substrate. By ion bombardment it is possible to control film characteristics or pre-clean the substrate.

If the system is equipped with a RF350‑e ion beam source as assist source, ion beam milling processes are also available on the same tool.

scia Coat 500
Technical Data
Substrate diameter
Up to 200 mm with load-lock
500 mm x 300 mm with manual loading
Ion Beam Source
Rectangular microwave ECR-source LIN380‑e
Neutralizer
Plasma bridge neutralizer N‑DC
Target Holder
Target drum with 6 targets (tiltable), each with max. 400 mm x 200 mm
Typical deposition rate
Si: 10 nm/min
Axes performance
Linear from 0.01 mm/min up to 15 mm/min; Rotation up to 300 rpm
Uniformity deviation
≤ 0.5 % over 200 mm dia.
≤ 2 % over 500 mm x 300 mm
Base pressure
≤ 5 x 10-8 mbar
System dimensions (W x D x H)
3.30 m x 1.70 m x 2.10 m
(without electrical rack, pumps and load-lock)
Tool configurations
1 process chamber, 1 load-lock optional
Software interfaces
SECS II / GEM, OPC on request

The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

The scia Coat 500 applies a beam from a linear ion beam source onto a rectangular sputter target. This linear geometry provides a good homogeneity of the deposited film in one dimension. Meanwhile, the sample is moved on a linear axis in a direction perpendicular to the beam's profile, thereby contributing to homogeneity or defined gradients of the coating in the second dimension.

In addition the sample stage is equipped with a spin rotation and a changeable shaper system (up to 4  shapers) in front of the sample stage.

  • Semiconductor, Solar & Electronics
Scia SystemsManufacturer of advanced ion beam and plasma processing systems, scia Systems established itself in a very short time on the worldwide market. Products are dedicated to the industry of Microelectronics, MEMS and precision optical manufacturing : etching, trimming, sputtering systems.
[Scia Systems, Deposition Systems, scia Coat 200, scia Coat 500, coating deposition]