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The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.

Available models

Scia Systems Multilayer 680
Technical Data
Substrate diameter
Up to 650 mm; weight up to 50 kg
Sputter source
Up to 6 rectangular 24” sputter magnetrons
Sputter modes
DC, RF, DC pulsed
Typical deposition rates
Cr: 45 nm/min; Si: 22 nm/min; Ti: 22 nm/min
Uniformity variation
< 0.1 % over 300 mm diameter; < 0.5 % over 450 mm diameter
Base pressure
< 1 x 10-8 mbar
System dimensions (W x D x H)
7.90 m x 4.40 m x 3.50 m (without electrical rack and pumps)
Tool configuration
1 load-lock with 1 coating chamber
Software interface
SECS II / GEM

The scia Multi 680 is designed for periodic multilayer coatings for substrates up to 650 mm dia. and 50 kg. Typical applications are gradient multilayer coatings of mirrors for soft X‑ray and anti-reflective coatings in UV and X‑ray applications.

The scia Multi 680 uses 6 radially arranged sputter magnetrons, each mounted in a separate housing for individual gas supply and a defined particle emission profile. The substrate is moved across the magnetrons in a circular path in face‑down orientation by a two-phase coupled rotary drive. Each orbital rotation completes one period of the multilayer stack. Precalculating the profiles of the orbital rotation enables compensation of the individual emission profiles of the magnetrons and deposition of required gradient films along the spin rotation axis.

Scia Systems Magna 200
Technical Data
Substrate diameter
Up to 200 mm
Substrate holder
Water cooled, up to 20 rpm rotation, helium backside cooling contact, RF bias
Sputter source
Double Ring Magnetron DRM 400 from Fraunhofer FEP
Sputter modes
DC, RF, uni- and bipolar pulse mode
Typical deposition rates
SiO2: 5 nm/s, Al2O3: 3 nm/s, Metals: 15 … 25 nm/s
Uniformity variation
≤ 0.5 %
Base pressure
< 1 x 10-6 mbar
System dimensions (W x D x H)
1.20 m x 2.00 m x 2.20 m (without electrical rack and pumps)
Tool configurations
Single wafer load-lock, cassette handling, cluster system
Software interfaces
SECS II / GEM, OPC

The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

The system is available with either a single wafer load-lock or an automatic handling robot in a cluster configuration. Its advanced substrate holder features simultaneous rotation, helium cooling and RF bias.

The special DRM 400 sputter source from Fraunhofer FEP has individually controllable plasma discharges from the concentric inner and outer target rings, enabling layer thickness variation of less than ± 0.5 % (over 200 mm). At the same time, very high deposition rates in reactive sputter mode can be achieved. Due to its integrated control mechanisms, long term stability of processing is ensured.

Scia SystemsManufacturer of advanced ion beam and plasma processing systems, scia Systems established itself in a very short time on the worldwide market. Products are dedicated to the industry of Microelectronics, MEMS and precision optical manufacturing : etching, trimming, sputtering systems.
[Scia Systems, Magnetron Sputtering Systems, sica magna 200, scia magna 680]