The 4See Series ensures wafer front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process.The 4See Series is built on a modular approach allowing to combine several modules depending on the customer needs.
LineScan module
•High depth of focus
•High resolution
•Multi line scan
•Strong topography can be inspected
•Low sensitivity to bow/warp
•Passive autofocus by design
Deflector module
•Nanometer topographical sensitivity with full field of view
•High Throughput
•Simultaneous double side inspection
Edge module
•Full wafer edge surface inspection at high speed
•Top surface, top bevel, APEX, bottom bevel, Bottom surface
•Near edge inspection possible