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UnitySC - TMAP

TMap Series provides highly accurate and repeatable wafer geometry measurements. TMap Series was designed to enable the easiest and fastest measurement for the user. TMap Series is available in manual, semi-automatic or full automatic configurations for wafers up to 300mm.


  • Hole in resist CD (FOWLP)
  • Die to wafer stacking (TSV)
  • Bonded wafer (TSV)
  • TTV on Epoxy Mold Compound rebuilt wafer (FOWLP)
  • Remaining Silicon Thickness (TSV)
  • Semiconductor, Solar & Electronics

UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market. Customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers. The company provides standard and customized advanced process control solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble, France, the company maintains offices in Taiwan and is supported by a network of representatives.

[UnitySC, TMAP]