Please leave a message
The original manufacturing method enhances adhesiveness between porous sections and base sections to achieve sufficient flatness even at boundary sections.
We can provide highly productive and reliable wafer thinning processing and manufacturing requiring whole surface absorption of large sized substrates.
We offer a wide selection of porous bodies with using different materials and pore sizes to cater to user needs.
We can also provide cooling hollow grooves in ceramic bases.
Fixation tools for :
|Product number||Density g/cm3||Coefficient of elasticity GPa||Bending strength MPa||Coefficient of thermal expansion ×10-6/K||Coefficient of thermal conductivity W/m・K||Electrical resistance Ω・cm|
|Silicon carbide||Standard product||3.1||410||500||4.6||170||170|
|Silicon carbide porous||-||2.1||55||50||4.7||-||26|