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X-RAY DIFFRACTION is the conventional and time proven technique for measuring residual stresses. Using the interatomic spacing as the ultimate gage length, the X-ray technique is ideal for and applicable to all crystalline materials, especially for metals, but also for ceramics. It measures the absolute stress without the need for an unstressed sample for calibration.
Stresstech Group’s Xstress 3000 G2/G2R represents advances in design and construction, which provide enhanced reliability and function in the first truly portable X-ray stress analyzer.
Meets or exceeds ANSI N43.3-1993 and other industry standards for open beam X-ray operation, including: