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Process technologies and equipment developed for Fan Out Wafer Level Packaging (FOWLP), Liquid Crystal Display (LCD) and Printed Circuit Board (PCB). Lower cost will enable this technology proliferate to a variety of semiconductor packaging applications for mobile electronics (SiP, APU, GPU, RF, Power Management, Memory Devices), Automotive and internet of Things (IOT).
Topaz’s unique modular architecture allowed Tango to become the first company to demonstrate:
Specifically designed to handle large panels with warpage of +/- 10mm for round or square or rectangular formats. Topaz uses the same proven technology used on Axcela for unparalleled process capabilities coupled with wide variety of options on the configuration to address both R&D and production requirements for deposition of adhesion and seed layers.
Based in the heart of Silicon Valley, Tango Systems, Inc. is a leading innovator in high performance, cost-effective PVD systems. The Axcela™ platform is the first in a new line of Cluster tools, currently used in high-volume production all across the globe.
Over the last decade, Tango's flexible Axcela™ 200/300 series has supplied tools for manufacturing in the Advanced Packaging, Hard Disk Drive (both Magnetic and non-Magnetic films), Ultra-thin films, Interposers and TSV markets, all with the industry's lowest Cost of Ownership.