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Designed for even more product changes per day, an even bigger range of components, increasing requirements for placement accuracy, speed and availability combined with high quality – naturally adaptive – engineering. Most feeders per sqm in the marketplace, intelligent set-up concepts, the largest board sizes together with the most compact system sizes and the falcon software based on Essemtec`s “eez-technology“ ensure highly efficient and economical SMD manufacturing for service providers and in-house production.

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Available models

Technical Specifications

Fox 4

Fox 2

Fox

Productivity: optimum placement speed
18’800 cph (4-axes)
12’000 cph (2-axes)
7’000 cph (1-axis)
Productivity: optimum jetting speed
-
150‘000 Dots/h
-
Feeder Capacity 8 mm Tape
200 (140 inline)
180 (120 inline)
180 (120 inline)
Component Size Range
008004 (imp.) - 80 x 80 mm
(Note specs for constraints)
Placement accuracy (x, y)
Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
Max. PCB dimensions
406 x 305 mm (16 x 12“)
Dimensions: machine footprint
880 x 1090 mm (34.7 x 43“)

Introducing - The Fox Pack - State of the art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.

Technical Specifications

Puma 4

Puma 2

Puma

Productivity: Optimum placement speed
18’100 cph (4-axes)
11’200 cph (2-axes)
6’700 cph (1-axis)
Productivity: Optimum jetting speed
System 180’000 dots/h - Valve 720’000 dots/h
System 180’000 dots/h - Valve 720’000 dots/h
-
Feeder capacity 8 mm Tape
280 (160 inline)
260 (140 inline)
260 (140 inline)
Component size range
008004 (imp.) - 80 x 80 mm
(Note specs for details)
Placement accuracy (x, y)
Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
Max. PCB dimensions
560 x 610 mm (22 x 24“)
optional 1’800 x 610 mm (71 x 24“)
Dimensions: Machine footprint
1’557 x 1’357 mm (61 x 53“)

Introducing - The Puma - State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.

Key Features

Combined Process

  • Placing & dispensing in single pass-through
  • Jet dispensing of solder paste or glue

Productivity

  • Up to 1000 - 18'800 cph per module
  • Up to 56400 cph per line (3 modules)

Small Footprint

  • Up to 200 feeder lanes on 1 sqm
  • Up to 420 feeder lanes per line

Mineral Cast

  • No vibration, symmetrical mineral casting
  • No warpage, no thermal drift

Quick Changeover

  • Nonstop production, intelligent smart feeder
  • Nonstop feeder and production changeover

Linear Motors

  • Fast, reliable double drive linear motors
  • No maintenance, longest lifetime

Combined Process

  • Highspeed placing and dispensing in single pass-through
  • 1, 2 or 4 placement-axes and 1-2 dispense processes

Productivity

  • Optimum 18100 cph, up to 54300 cph inline
  • Optimum jetting speed 180'000 - 720'000 dots/h

Small Footprint

  • Up to 280 Feeder on 2 m? (up to 420 inline)
  • PCB size 560 x 610 mm, optional 1800 x 610 mm

Mineral Cast

  • No vibration, symmetrical mineral casting
  • No warpage, no thermal drift

Quick Changeover

  • Nonstop production, intelligent smart feeder
  • Nonstop feeder and production changeover

Linear Motors

  • Fast, reliable double drive linear motors
  • No maintenance, longest lifetime

Essemtec Application - Puma and Fox on the hunt

Applicationclip of our Pick-and-Place "beasts" Fox and Puma. All Scenes from our product videos raw in real-time. No fast-forward, no effects, no post stabilisation.

Essemtec - Puma Relentless High Speed Pick-and-Place and Dispensing

Puma is worlds first high-speed pick and place solution that can be also used in the ultra-flexible prototyping development sector. 

  • Semiconductor, Solar & Electronics
EssemtecEssemtec leads the industry in adaptive SMT pick-and-place equipment for both high-speed- and micro-dispensing, as well as an intelligent production storage and logistic systems. Our products are equipped with user-friendly software packages, enabling flexible mounting and dispensing design that is unique in the market, as well as extensive and efficient material management. The combination of printed circuit board (PCB) placement accuracy, speed, and high-quality engineering makes our offerings unique. Equipped with the most up-to-date technology, Essemtec products allow easy programming and operation for a wide range of applications.
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