Need support?

Please leave a message


ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features

  • Designed for cutting hard and brittle materials
  • Minimizes chipping and cracking
  • Long-lasting performance

Contact us

Available models

Resin-Bond Dicing Blades

ADT’s Resin-bond Blades are manufactured through a unique proprietary molding process. When cutting hard and brittle materials, the edge of the blade wears out at a controlled rate exposing new diamonds to constantly sharpen the blade and thus achieve highly accurate kerf, outstanding yield and exceptional blade life.

Features & Benefits

  • Self-sharpening matrix to expose new diamonds
  • Superior cut quality
  • Best performing matrix for hard, brittle and composite materials
  • The widest variety of combinations for your most challenging applications
  • High precision dicing
  • Attractive Cost-of-Ownership (CoO)
Metal Sintered Dicing Blades

In a unique close-mold sintering process, diamond grit size, diamond concentration and metal binder are optimized to meet the precision and blade life requirements of your specific application. The metal binder provides a very stable, stress-free blade matrix and can be custom tailored to meet the required hardness and load resistance for dicing a variety of applications.

Features & Benefits

  • The widest variety of matrixes for a broad range of applications
  • Less wear/higher blade life
  • Highly accurate blade dimensions
  • High precision dicing
  • Attractive Cost-of-Ownership (CoO)
Nickel-Bond Dicing Blades

ADT’s Annular Nickel Blades are produced using a state-of-the-art, tightly controlled electroforming process which guarantees a uniform distribution of diamonds througout the Nickel layer. This process not only allows for blades to be produced to very tight tolerances but also permits optimization of grit size, hardness and geometry to meet the particular requirements of your application.


  • The hardest binder for superior wear resistance
  • The thinnest blade available (down to .0008”)
  • Excellent rigidity for higher exposure
  • Exceptionally long blade life
  • High precision dicing
  • Attractive Cost-of-Ownership (CoO)

  • Semiconductor, Solar & Electronics
ADT DicingAdvanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.