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ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

 

Key Features

  • Used for dicing wafers and substrates into smaller chips
  • High accuracy and low kerf loss for optimal yield
  • Compatible with a wide range of materials and thicknesses
  • Robust and durable design for long-term use
  • Offers advanced automated blade height adjustment and real-time monitoring.

 

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Available models

Water Recycling System AR-927
Specifications
Value
Flow capacity
<20 L/min
Supply pressure
<5 bar
Dimensions (W x D x H)
620 x 1280 x 1720

mm3

Air pressure
6-8 bar

Designed for closed-loop, uniform supply of cutting water. It recycles drain water thru filtering, cooling and pumping to maintain required purification, temperature and flow levels for optimized dicing, cost saving and environment care.

Wafer Cleaner
Specifications
997
997L
Max workpiece size
Ø 200 (8”) min
Ø 300 (12”) min
Spinner velocity range
50-3,000 rpm
50-2,000 rpm
Dimensions (W x D x H)
410 x 625 x 946

mm3

502 x 809 x 946

mm3

Weight
120 Kg
200 Kg

Designed for after-dicing workpiece cleaning and drying. Equipped with a spinning chuck table and a rotating washing/drying arm. The arm can be configured with an atomizing cleaning nozzle or a high pressure nozzle to cope with a wide range of cleanliness requirements.

Semi Auto Wafer Mounter
Specifications
967
967L
Supported tapes
Dicing Blue-tapes / UV tapes
Dicing Blue-tapes / UV tapes
Max Workpiece size
Ø 200 (8”) mm
Ø 300 (12”) mm
Dimensions (W x D x H)
655 x 590 x 560

mm3

791 x 706 x 557

mm3

Air pressure
6-8 bar
6-8 bar

Designed for quality, hands-free mounting of workpieces on tapes.
It features fast, consistent, precise and economic mounting at an exceptional cost-performance.

Manual Wafer Mounter 996/996L
Specifications
996-8"
996-12"
Max workpiece size
Ø 200 (8”) mm
Ø 300 (12”) mm
Temp control chuck heater
<65 °c
<65 °c
Dimensions (W x D x H)
420 x 860 x 370

mm3

550 x 1000 x 310

mm3

Air pressure
45 bar
60 bar

Designed for manual mounting of workpieces on tapes. Supporting various types of dicing tapes and standard frames. Can be customized for multiple substrates (multi-panel) and irregular frames.

UV Curing Systems 995/995L
Specifications
995-8"
995-12"
Max. frame Diameter
300 mm
400 mm
Exposure area
250 x 250

mm2

Ø430

mm2

Dimensions (W x D x H)
510 x 450 x 120

mm3

645 x 526 x 180

mm3

Weight
20 Kg
30 Kg

Designed for after dicing UV tape curing to reduce the adhesive strength for ease of workpiece removal.

Spindle Chiller 937-A
Specifications
Value
Temperature range
8-35 °c
Stability
±0.1 °c
Dimensions (W x D x H)
526 x 360 x 555

mm3

Designed for closed-loop supply of spindle cooling water. It maintains stable, temperature-controlled water; an important factor for achieving high dicing accuracy and quality.

C02 Injector 947
Specifications
Value
Resistivity setting range
0.1-1 MΩ/cm
Water capacity*
3-10 L/min
Dimensions (W x D x H)
190 x 446 x 365

mm3

Weight
6-8 Kg

Designed for decreasing the resistivity of deionized (DI) water to a predefined level. Aimed at preventing particle adhesion and damage caused by static discharge during the dicing process.

  • Semiconductor, Solar & Electronics
ADT DicingAdvanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.
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