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Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

Key Features 

  • New User Interface (NUI) Upgrade Kit
  • Dicing Floor Management (DFM)
  • Height Measurement Tool (HMT)
  • Dressing Procedure

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Available models

Fully Automatic 12
Specifications
8030
Workpiece Size
Ø 8”, Ø 12" or 12" × 12" Square
Blade Size
2” - 3”
X Axis
Air Slide
Cleaning Method
Atomized cleaning capabilities
Dimensions (W × D × H) mm
1,145 × 1,687 × 1,830 1,500

ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8030 is a high accuracy system that can dice product up to 12” in diameter or 12” × 12” product, at high performances and low cost of operation.

Features

  • Flexibility - Supports Hub and Hubless blades up to 3” O.D.
  • Spindles of 1.8 kW or 2.2 kW high power
  • Bridge type frame supporting efficient wafer processing
Fully Automatic 8
Specifications
8020
Workpiece Size
Ø 8”
Blade Size
2” - 3”
X Axis
Air Slide
Cleaning Method
Atomized cleaning capabilities
Dimensions (W × D × H) mm
1,015 × 1,460 × 1,820 1,300

ADT 8020 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.

Features

  • Flexibility - Supports Hub and Hubless blades up to 3” O.D.
  • Spindles of 1.8 kW or 2.2 kW high power
  • Intuitive operation interface using a large 19” touch screen monitor
7900/20/30 Atuomatic Twin
Specifications
7900 Duo
7920 Duo
7930 Duo
Workpiece Size
Ø 8"
10" × 10"
12" × 10" or Ø 12"
Blade Size
2” - 3”
2” - 3”
2” - 3”
X Axis
Air Slide
Air Slide
Air Slide
θ Axis, Repeatability
4 arc-sec
4 arc-sec
4 arc-sec
Dimensions (W × D × H) mm
875 × 975 × 1450
875 × 975 × 1450
875 × 975 × 1450

ADT 7900 series has two facing spindles that can simultaneously dice wafers or packages at high throughput. ADT 7900 series is a high accuracy system that can dice product at high performances and low cost of operation.

Features

  • Simple Blade Change
  • SECS/GEM platform ready
  • Full access to any area of the system for easy maintenance
Automatic 8
Specifications
7122
7124
7132
7134
Workpiece Size
Ø 8"
Ø 8"
Ø 12" or 300mm × 300mm W/O frame
Ø 12" or 300mm × 300mm W/O frame
Blade Size
2” - 3”
4'' - 5''
2” - 3”
4'' - 5''
X Axis
Air Slide
Air Slide
Air Slide
Air Slide
θ Axis, Repeatability
4 arc-sec
4 arc-sec
4 arc-sec
4 arc-sec
Dimensions (W × D × H) mm
965 × 1300 × 1600
965 × 1300 × 1600
965 × 1300 × 1600
965 × 1300 × 1600

The 7120 / 7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility to support your needs.

Features

  • Support 2"-3" and 4"-5" blade O.D. with large ‘Z’ stroke
  • ‘X’ axis air bearing for smooth motion and super cut quality
  • Automation with high resolution optics
72xx Fully Automatic Dicing System
Specifications
7222
7223
7224
Workpiece Size
Ø 8"
Ø 8"
Ø 8"
Blade Size
2” - 3”
4'' - 5''
2” - 3”
X Axis
Air Slide
Air Slide
Air Slide
θ Axis, Repeatability
4 arc-sec
4 arc-sec
4 arc-sec
Dimensions (W × D × H) mm
965 × 1460 × 1700
965 × 1460 × 1700
965 × 1460 × 1700

The 7200 system offers a wide range of advanced automation and process monitoring option to meet the throughput and quality requirements of your most challenging dicing applications: silicon, glass on silicon, glass, BGA & QFN packages, LTCC, ceramic, PCB and other hard material applications.

Features

  • Efficient wafer handling system
  • Continuous digital magnifications vision system
  • Blade wear prediction algorithm reduces height measurement time and increases UPH

ADT Dicing Saws

  • Semiconductor, Solar & Electronics
ADT DicingAdvanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.
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