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Mitsubishi Materials - Low Alpha Copper (Cu) bathes - MULAS - for wafer plating

INDONESIA

Maggie Yang, Managing Director, Technology

+62 81 7988 2288
Fax +62 22 2988 7870
Contact Email
PT. DKSH Indonesia
AIA Central 39th floor. Jalan Jenderal Sudirman Kavling 48A
12930 Jakarta Selatan
Indonesia
Mitsubishi Materials - Low Alpha Copper (Cu) bathes - MULAS - for wafer plating

The MULAS Cu bathes are dedicated to semiconductor applications for wafer plating in order to produce copper pillars, micro copper pillars and RDL.

Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry.

The flexibility and the reliability of their bathes offer a huge process window with the possibility to use current densities from 10 ASD to 25 ASD (up to 5.5µm/min).

  • Semiconductor, Solar & Electronics
  • Chemical
Mitsubishi Materials Corporation - Electronic materials & Components companyMitsubishi Materials Corp. Electronic is a division of Mitsubishi Materials providing solutions for the semiconductor activity. Mitsubishi Materials Corp. Electronic develops chemistries based on metals and alloys related to the bumping and interconnections processes, or related to MEMS production or optical applications.
[Mitsubishi Materials, Copper, Low alpha bath Cu, MULAS]

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