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EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
|Applications||Micro Via Drilling, Routing, Depaneling, Micro Structuring,
Selective Ablation, Cavity Formation
|Accuracy||< +/-10 μm abs.
< +/-2 μm repeatability
|Substrates||Dimension up to 29.5” x 25” (750 mm x 635 mm)
Rigid-, flex-PCBs, ceramic, glass and advanced materials
|Available laser sources||Wavelength: 9.4, 10.6 μm (CO2), 1064, 1030, 532, 515,
Pulse: μs, ns, ps, fs
|Dimensions||1750 x 2200 x 2600 mm|