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ATV’s successful SRO-71X series IR vacuum reflow oven is the heart of ATV’s reflow soldering principle. Our ATV-TCB, Thermal Compression Bonding is also based on which this system is developed. The Single Cold Wall Process Chamber approach is a standard on itself and is also applied for the ATV-TCB which fulfills all your process requirements.

Our Thermal Compression Bonding system has an isostatic press in combination with an elastomer membrane. This patented technology gives you the opportunity to use a maximum pressing force of 0,5MPa over 150 mm Ø. This pressure can be gradually built up to the desired process pressure under which you want to perform your process. With our applied membrane technology you will not be faced with product shifting from start to finish. Another advantage for our technology is that you may process simultaneously products which have a different topography. This will have no influence on the expected final process results.

Also in this tool ATV uses all its know-how of the cold wall technology in combination with the IR heating concept, vacuum assembly as well as formic acid atmosphere to achieve the prefect solder joints you need for a reliable product. Working with the ATV-TCB you will notice that programming is easy and with the 100 step programming steps you will be able to fine tune your process in such a way that a process success is guaranteed.

Key Features

  • Viewing Window
  • Membrane Assembly  ≤ 5 bar Gas Pressure
  • Safety Alarms
  • Formic Acid Supply Assembly Two Gas Supply Connections


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Technical Specification

Footprint 760 x 960 x 1.800 mm (L x W x H)
Weight 240 kg (minimum configuration)
Working Height 950 up to 1080 mm adjustable
Heated Area 217 x 227 mm; Ø 160 mm for the bonder configuration
Chamber Lid Open/Closing Automatic lid closing/opening and locking/unlocking
Heating Method PID controlled IR lamp array heating principle of heated plate
Cooling PID controlled cooling with Nitrogen
  • Semiconductor, Solar & Electronics
ATV Technologie Gmbh

Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.

With an expert team of engineers and physicists rooted in precision mechanics, eletronical and mechanical engineering ATV Technologie GmbH designs and develops a product range at the highest level of quality. Universities, institutes, laboratories and leading production companies worldwide appreciate our customized solutions. 

ATV offers long-standing experience in designing and manufacturing high-end process systems featuring precise temperature control and excellent homogeneity for semiconductor technology and micro electronics as well as a worldwide network of special representatives who will take care of on-site sales and service.