ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.
Key Features
ADT’s Resin-bond Blades are manufactured through a unique proprietary molding process. When cutting hard and brittle materials, the edge of the blade wears out at a controlled rate exposing new diamonds to constantly sharpen the blade and thus achieve highly accurate kerf, outstanding yield and exceptional blade life.
Features & Benefits
In a unique close-mold sintering process, diamond grit size, diamond concentration and metal binder are optimized to meet the precision and blade life requirements of your specific application. The metal binder provides a very stable, stress-free blade matrix and can be custom tailored to meet the required hardness and load resistance for dicing a variety of applications.
Features & Benefits
ADT’s Annular Nickel Blades are produced using a state-of-the-art, tightly controlled electroforming process which guarantees a uniform distribution of diamonds througout the Nickel layer. This process not only allows for blades to be produced to very tight tolerances but also permits optimization of grit size, hardness and geometry to meet the particular requirements of your application.
FEATURES & BENEFITS
Attractive Cost-of-Ownership (CoO)