ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.
Key Features
Specifications
|
Value
|
---|---|
Flow capacity
|
<20 L/min
|
Supply pressure
|
<5 bar
|
Dimensions (W x D x H)
|
620 x 1280 x 1720
mm3 |
Air pressure
|
6-8 bar
|
Designed for closed-loop, uniform supply of cutting water. It recycles drain water thru filtering, cooling and pumping to maintain required purification, temperature and flow levels for optimized dicing, cost saving and environment care.
Specifications
|
997
|
997L
|
---|---|---|
Max workpiece size
|
Ø 200 (8”) min
|
Ø 300 (12”) min
|
Spinner velocity range
|
50-3,000 rpm
|
50-2,000 rpm
|
Dimensions (W x D x H)
|
410 x 625 x 946
mm3 |
502 x 809 x 946
mm3 |
Weight
|
120 Kg
|
200 Kg
|
Designed for after-dicing workpiece cleaning and drying. Equipped with a spinning chuck table and a rotating washing/drying arm. The arm can be configured with an atomizing cleaning nozzle or a high pressure nozzle to cope with a wide range of cleanliness requirements.
Specifications
|
967
|
967L
|
---|---|---|
Supported tapes
|
Dicing Blue-tapes / UV tapes
|
Dicing Blue-tapes / UV tapes
|
Max Workpiece size
|
Ø 200 (8”) mm
|
Ø 300 (12”) mm
|
Dimensions (W x D x H)
|
655 x 590 x 560
mm3 |
791 x 706 x 557
mm3 |
Air pressure
|
6-8 bar
|
6-8 bar
|
Designed for quality, hands-free mounting of workpieces on tapes.
It features fast, consistent, precise and economic mounting at an exceptional cost-performance.
Specifications
|
996-8"
|
996-12"
|
---|---|---|
Max workpiece size
|
Ø 200 (8”) mm
|
Ø 300 (12”) mm
|
Temp control chuck heater
|
<65 °c
|
<65 °c
|
Dimensions (W x D x H)
|
420 x 860 x 370
mm3 |
550 x 1000 x 310
mm3 |
Air pressure
|
45 bar
|
60 bar
|
Designed for manual mounting of workpieces on tapes. Supporting various types of dicing tapes and standard frames. Can be customized for multiple substrates (multi-panel) and irregular frames.
Specifications
|
995-8"
|
995-12"
|
---|---|---|
Max. frame Diameter
|
300 mm
|
400 mm
|
Exposure area
|
250 x 250
mm2 |
Ø430
mm2 |
Dimensions (W x D x H)
|
510 x 450 x 120
mm3 |
645 x 526 x 180
mm3 |
Weight
|
20 Kg
|
30 Kg
|
Designed for after dicing UV tape curing to reduce the adhesive strength for ease of workpiece removal.
Specifications
|
Value
| |
---|---|---|
Temperature range
|
8-35 °c
| |
Stability
|
±0.1 °c
| |
Dimensions (W x D x H)
|
526 x 360 x 555
mm3 | |
Designed for closed-loop supply of spindle cooling water. It maintains stable, temperature-controlled water; an important factor for achieving high dicing accuracy and quality.
Specifications
|
Value
|
---|---|
Resistivity setting range
|
0.1-1 MΩ/cm
|
Water capacity*
|
3-10 L/min
|
Dimensions (W x D x H)
|
190 x 446 x 365
mm3 |
Weight
|
6-8 Kg
|
Designed for decreasing the resistivity of deionized (DI) water to a predefined level. Aimed at preventing particle adhesion and damage caused by static discharge during the dicing process.