ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
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SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.
We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.
With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.