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SET - FC300

The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.


  • Infrared and X-Ray image sensors
  • 3D-intergration
  • Memory stacking
  • Optoelectronics and Silicon Photonics
  • Flip Chip bonding
  • Mass Transfer of mini and micro LED
  • Quantum Computing
  • Die bonding
  • Chip to Chip
  • Chip to Wafer
  • Nanoimprinting


  • Infrared and X-Ray image sensors
  • Semiconductors
  • Memory
  • Optoelectronics and Silicon Photonics
  • Micro LEDs displays
  • Quantum Computing

Key features

  • Accuracy ± 0.5 µm
  • Low/High of bonding forces
  • Perfect parallelism control
  • Confining gas including formic acid
  • Unique vision system
  • Form R&D to pilot line

Technical specifications

Contact us for more information


SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

[SET, bonder, FC300]