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The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.


  • Laser diode, laser bar
  • VCSEL, photo diode
  • LED
  • Prisms, lenses, mirrors
  • Micro Assembly
  • Flip-chip bonding, die bonding
  • Chip-to-chip, chip-to-substrate bonding


  • Optoelectronics and Silicon Photonics

Key features

  • Accuracy ± 0.5 µm
  • Low bonding force
  • Confining gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

Technical specifications

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SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

[SET, ACCURA OPTO, bonder]