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SET - ACCµRA100

The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

Applications

  • Micro assembly
  • Laser diode, laser bar
  • VCSEL, photo diode
  • LED
  • Flip-chip bonding, die bonding
  • Chip-to-chip, chip-to-substrate bonding
  • MOEMS, MEMS, MCM packaging…
  • 3D packaging
  • Nanoimprinting (UV NIL and Hot Embossing)

Industries

  • Semiconductors
  • Memory
  • Optoelectronics and Silicon Photonics
  • Micro LEDs Displays
  • Quantum Computing

Key features

  • Accuracy ± 0.5 µm
  • Easy to use and very flexible
  • Quick set-up for new applications
  • Cost-effective
  • Small footprint and compact design
  • High bonding force

Technical specifications

Contact us for more information

 

SET - ACCµRA100

  • Semiconductor, Solar & Electronics
SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

[SET, ACCURA100, bonder]