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SET - LDP150

TAIWAN

Robert Wang, Senior Sales Manager

+886 921 075 612
Contact Email
10F, No. 22, Lane 407, Ti-Ding Blvd., Section 2, NeiHu Technology Park
114 Taipei
Taiwan
SET - LDP150

The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

The LDP150 is able to apply pressure up to 100,000N.

Applications

  • Large infrared focal plane arrays
  • Military and space applications
  • Large XY, UV detector

Key features

  • Self leveling sphere moving on air bearing and locked by vacuum preserves the initial parallelism of the component stack
  • High force (up to 100,000N) and controlled force profile ensure bond join quality
  • Granite base and rigid stiff steel structure maintain the initial high accuracy of the assembly
    - XY : ± 1 µm
    - Parallelism : ± 1 µm​
    - Independent of component size

Technical specifications

Contact us for more information

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SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

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[SET, bonder, LDP150]

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