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NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.


  • Hybrid / Direct bonding (room temperature)
  • Flip-chip bonding, die bonding 
  • Chip-to-wafer, wafer level applications
  • Chip-to-substrate bonding
  • Pick & Place
  • Memory stacking
  • 3D IC

Key features

  • High post-bonding accuracy ± 1 µm @ 3σ
  • High throughput 1,000 uph
  • Stand alone or full automatic
  • Cleanliness level ISO 5 stand alone
  • Cleanliness level ISO 3 full automatic
  • High flexibility and reliability
  • Creative design

Technical specifications

Contact us for more information



  • Semiconductor, Solar & Electronics
SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

[SET, bonder, NEO HB]