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The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.


  • Flip chip, die attach
  • Chip-to-chip, chip-to-substrate 
  • Laser diode, laser bar
  • VCSEL, photodiode
  • LED
  • Micro assembly


  • Universities and R&D institutes

Key features

  • Accuracy ± 3 µm
  • Process controlled thanks to closed loop system
  • Easy to use
  • Granite structure offering high stiffness
  • Vertical arm avoiding lateral shift during bonding
  • Very small footprint on open platform

Technical specifications

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SET Smart Equipment Technology

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.

With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

[SET, ACCURA M, bonder]